Honor Magic 2 3D Price in Bangladesh bd & Reviews

Honor Magic 2 3D Price in Bangladesh bd & Reviews.Honor Magic 2 3D Specifications, Price,Release Date, Reviews – mobilemaya Honor.

Honor Magic 2 3D Price in Bangladesh
Honor Magic 2 3D Price in Bangladesh
NameHonor Magic 2 3D
PriceNot announced yet
General
2GGSM 850 / 900 / 1800 / 1900 – SIM 1 & SIM 2
CDMA 800 & TD-SCDMA
3GHSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
4GLTE band 1(2100), 2(1900), 3(1800), 4(1700/2100), 5(850), 6(900), 7(2600), 8(900), 12(700), 17(700), 19(800), 34(2000), 38(2600), 39(1900), 40(2300), 41(2500)
SimDual SIM (Nano-SIM, dual stand-by)
AnnouncedMarch, 2019
StatusAvailable. Released March, 2019
Body
Dimension157.3 x 75.1 x 8.3 mm (6.19 x 2.96 x 0.33 in)
Weight206 g (7.27 oz)
Display
TypeAMOLED capacitive touchscreen, 16M colors
Size6.39 inches, 100.2 cm2 (~84.8% screen-to-body ratio)
Resolution1080 x 2340 pixels, 19.5:9 ratio (~403 ppi density)
MultitouchYes
Camera
PrimaryTriple 16 MP, f/1.8, PDAF
16 MP, f/2.2
24 MP B/W, f/1.8
FeatureLED flash, panorama, HDR
SecondaryDual Mechanical pop-up 16 MP, f/2.0
Mechanical pop-up 3D TOF camera
Mechanical pop-up 2 MP, f/2.4, depth sensor
FeatureHDR
Video2160p@30fps, 1080p@30fps, 720p@480fps
Memory
CardNo
Internal memory128 GB
256 GB
512 GB
RAM6 GB
8 GB
Data
GPRSYes
EDGEYes
WLANWi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth5.0, A2DP, aptX HD, LE
Usb2.0, Type-C 1.0 reversible connector, USB On-The-Go
OTGYes
NFCYes
Features
OSAndroid 9.0 (Pie)
EMUI 9 or Magic UI 2
ChipsetHiSilicon Kirin 980 (7 nm)
CPUOcta-core (2×2.6 GHz Cortex-A76 & 2×1.92 GHz Cortex-A76 & 4×1.8 GHz Cortex-A55)
GPUMali-G76 MP10
SensorFace ID, fingerprint (under display), accelerometer, gyro, proximity, compass
RadioNo
GPSYes, with dual-band A-GPS, GLONASS, BDS, GALILEO, QZSS
ColorGradient Black, Gradient Red, Gradient Blue
Special Feature
Battery
BatteryNon-removable Li-Po 3500 mAh battery
ChargingFast battery charging 10V/4A 40W: 50% in 15min; 85% in 30min
Others

Add a Comment

Your email address will not be published. Required fields are marked *